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    Sheet Metal Laser Cutting Machine SMART Series LM Series WALC-Q Series WALC-P Series WALC-QP Series WALC-F Series GF Series MARVEL Series MARVEL Plus Series MARVEL PRO Series MARVEL H series WALC Series LCK Series LCL Series GR-P Series GR-C Series BF Series CPL-3X2150
    High Precision Laser Cutting Machine LCK10G FPC Series LK Series LUGD Series
    Tube Laser Cutting Machine TP12052F & LT12052F TP12036M & LT12036M TP10032W & LT10032W GF3015 TUBE TP6322 & LT6322 Profile Series
    3D Laser Cutting Machine STCS Series STC Series UBC Series H Beam Laser Cutting Machine Profile Steel Laser Cutting Machine AUTOBOT Series SF Series SF4025G SF3015E 3D SR Robot Series
    Laser Marking System LCD/LCB Series LSC Series LSF 3D Series LSU Series LSG Series LSF-M Series LSF Series
    Flying Laser Marking Machine Flying7050 Series Flying F Series Flying C Series Flying U Series
    Precision Laser Welding Machine SMART HW Series LWD Series LWF Series LWF-QC Series LWY-C Series
    High Power Laser Welding Machine JRC Series RC Series JR Tray Series Flexible Car Chassis Laser Welding System Flexible Car Rear Cover Laser Welding System Flexible Car Side Body Laser Welding System Automobile Gear Series PW Series Automobile Laser Welding Solutions Laser welding Solutions-Tube series
    Laser Cleaning Machine Aircraft Skin Laser Cleaning Series Electric Core Pet Film Laser Cleaning Series Tire Mold Online Series Tire Mold Offline Series Fully Automatic Series Pressure Vessel Series U-RIB Series Metal Pipe Cleaning Series Storm Series BUZZ Series
    Lithium Battery Laser Welding Solutions SHAPED MODULE WELDING LINE SOFT PACKAGE MODULE WELDING LINE FULLY AUTOMATIC ASSEMBLY AND WELDING EQUIPMENT FOR SOFT PACKAGE MODULES LIQUID INJECTION HOLE WELDING EQUIPMENT
    Photovoltaic Laser Processing Machines SOLAR PV-SCREEN PRINTING GRID VERSION FILM CUTTING EQUIPMENT PHOTOVOLTAIC GLASS PUNCHING EQUIPMENT
    Specialized Products for Semiconductor Industry Wafer Defect Detection Series Defect Detection Series Wafer Thickness Measuring Series Wafer Marking Series Wafer Marking Series Wafer Cutting Series Wafer Slotting Series Laser Scribing Series Laser Scribing Series Wheel Cutting Series
    Specialized Products for PCB Microelectronic SMT Laser Depaneling Series SMT Double Head PCB Laser Marking Series IC Substrate X-Out Laser Marking Series High-Speed FPC Laser Drilling Series Full-automatic IC Packaging and Laser Marking Series FPC Pico UV Laser Cutting Series Ceramic Substrate Laser Cutting Series
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  • SHIPBUILDING INDUSTRY

    The Rise of Great Nations, All Beginning with Shipbuilding and Dominating the Seas. As a symbol of a country's industrial prowess, the shipbuilding industry boasts exceptional industry expansion and a powerful economic driving force, earning it the title of the 'crown jewel of comprehensive industry.' In recent years, in response to the trend of transformation and upgrade in the shipbuilding industry, HGTECH has actively entered the high-end shipbuilding sector. From the cleaning and cutting of raw materials for ship components, to the welding of small, medium, and large components, to the planning and design of intelligent production lines for ship thin plate flat sections, and the advanced manufacturing of core components for green energy power systems, we have accelerated the realization of an integrated laser intelligent manufacturing solution for ship components and the collaborative upgrade of high-end, green, and intelligent shipbuilding technologies.

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  • NEW ENERGY AUTOMOBILE INDUSTRY

    Laser intelligent manufacturing empowers the rapid development of the new energy automobile industry. As an important manifestation of the integration of new technology and high-end equipment, automobile manufacturing reflects the highest level of national manufacturing. At present, in automobile manufacturing, about 50%-70% of body parts can be processed by laser, and laser processing technology and equipment has become the development direction of international automobile manufacturing.

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  • 3C INDUSTRY

    Electronic products play various roles in people's daily life, such as providing information, offering convenience and inspiring creativity. Being lighter, thinner and more portable have become the goal of designers, which has also brought continuous progress of new materials and new techniques. Laser has become the representative in the manufacturing process of electronics products.

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  • PACKAGING INDUSTRY

    With the development of packaging industries like chemical, food and drug, the limitations of original ink-jet printing in materials and technology has been increasingly exposed to us. The emergence of laser technology has solved many problems of traditional methods, improved anti-counterfeiting technical means and the anti-counterfeiting ability of enterprises. The development and application of laser technology in the field of packaging has also received people's attention. Laser processing can not only improve the technical level of packaging industry, but also improve the grade and added value of products.

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  • SHEET METAL CUTTING

    Over the past several decades, China has gradually become an international processing and manufacturing center. With the demand for metal processing is increasing, the complexity of the process is becoming higher and higher. In terms of precision, higher requirements are also put forward for sheet metal processing which is the main component of metal processing in industrial production activities, and is also an important process of forming sheet metal products. It is widely used in various fields, such as household appliances, instrument metal shells, road billboards, garbage cans, charging piles and car washing machines.

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  • ELECTRONIC CIRCUIT

    The PCB industry is an important part of the electronic information industry. With the support and protection of the national industrial policies and relevant laws and regulations, the industry market scale is expanding. The rapid development of 3C electronics, smart cars, IC carrier boards and other markets has provided the PCB industry with a driving force for sustained growth, while also putting forward new requirements for its processing technology. The non-contact and lossless processing characteristics of precision laser meet the development needs of fine, high-density and high-performance printed circuit boards. Therefore, it is more and more widely used in the this industry. HGTECH provides the PCB industry with overall cutting, marking and automation solutions.

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