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Wafer Marking Series

Wafer Laser Marking Equipment

Facing the semiconductor industry, the wafer manipulator and external coaxial vision positioning technology are adopted to realize the full-automatic laser marking of 2-6 inch wafers.
Wafer Laser Marking Equipment
Wafer Marking Series
Facing the semiconductor industry, the wafer manipulator and external coaxial vision positioning technology are adopted to realize the full-automatic laser marking of 2-6 inch wafers.

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PRODUCT DATA



Product advantages:

  • • High automation

  •   Special robot for wafer automatic picking and placing, automatic focusing

  • • Strong compatibility

   With different light sources, it can adapt to different accuracy levels

  • • High fault tolerance

   Intelligent, visual positioning + automatic edge finding, high fault tolerance


 


Sample display:



Sample 1

laser marking

 

Sample 2

laser marking

 

Sample 3

laser marking

 

Sample 4

laser marking

 

Sample 5

laser marking



Item

Main parameters

Laser

Model

LSF20

LSU5EB
Laser light source

Fiber laser

UV laser

Laser wavelength

1064nm

355nm
Average power

20W

5W

Performance

 Machining accuracy

±0.1mm

±0.05mm
Max width

150×150mm

150×150mm
Support document format

bmp,jpg,png,ai,dxf,dst,plt

Others

Power supply specification

2.0KW/AC220V/50HZ

Temperature

0-40℃

＜35℃

Overall size（length×width×height）

1250mm*900mm*1900mm


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