Product advantages:

• • High processing quality

The cutting line width is narrow (taking ultraviolet dicing as an example: including HAZ ≤ 30 ± 5 μm) , small edge collapse ≤ 10 μm

• • High processing efficiency

UPH ≥ 15 (take 40mil, 5-inch GPP wafer as an example, including automatic loading and unloading)

• • Good processing stability

Nanosecond laser has high power stability and good beam quality (M ² < 1.5)

Sample display:

Front positioning, front cutting: 4-inch flat wafer, grain

Front positioning, back cutting: 5-inch GPP wafer