Product advantages:
This equipment can be used for 4-8 inch patterned wafers
Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss
System resolution: 0.2-0.8 μ m
Patterned wafer: 15 minutes / wafer when the number of defects is less than 200
Sample display:
The gold plating layer falls off
Crackle
Coating surface detection
Scratch