Suitable
for the packaged IC surface marking , automatic loading and unloading,
automatic width adjustment, and the effect of the mark detection through
OCR and the MES data analysis system and data feedback can improve the
process yield and manufacturing efficiency.
Product advantages:
With
the development of printed circuit boards towards refinement, high
density and high performance, precision lasers are more and more widely
used in the downstream industry of circuit boards because of their
non-contact, stressless, and flexible processing characteristics.
HGLASER PCB Microelectronics Division provides integrated solutions for
the upstream and downstream industries of PCB such as laser cutting,
marking, automation, and full-process traceability management.
- • Focus on laser applications in SMT
factories, providing customers with automated production line solutions
for laser coding, laser cutting and splitting + testing + automatic
sorting + automatic packaging.
- • Focus on the application of FPC
industry, providing customers with professional solutions for the core
process of FPC cover film roll-to-roll cutting, FPC shape cutting, FPC
high-speed drilling and other industries.
- • Focus on the application of IC
substrate industry in PCB, providing customers with laser marking
equipment for large IC substrates, Xout marking equipment for finished
boards, visual inspection machines for finished boards, AOI inspection
machines, automatic sorting machines, automatic packaging machines and
other full-process laser+ automated solutions.
- • Focus on the advanced packaging industry, providing customers with fully automatic laser marking equipment after IC packaging.
- • Focus on the ceramic substrate
industry, providing customers with fully automatic ceramic substrate
drilling, scribing, cutting and marking equipment.