Product advantages:
Use ultra short pulse processing to reduce edge collapse,
delamination and thermal impact, and adopt high-precision visual
positioning to ensure the slotting position
Based on spatial light modulation technology, the size and
shape of the shaping spot can be adjusted, and the laser energy
utilization rate is high and the response is fast
Integrated protective liquid coating, wafer slotting and cleaning module
Sample display:
Low-k wafer slotting, depth > 10 μm， Width: 40 μm.
