Developed
for high-speed, high-precision drilling applications for soft and rigid
combination boards and other materials, with high precision, high
efficiency, micro-hole processing, and convenient shape change, as well
as processing for shape and cover film cutting.
Original
patented technology - FPC Laser Shield Laser drilling Technology,
developed ultraviolet high-speed drilling equipment to achieve blind
holes in one hit.
Product advantages:
With
the development of printed circuit boards towards refinement, high
density and high performance, precision lasers are more and more widely
used in the downstream industry of circuit boards because of their
non-contact, stressless, and flexible processing characteristics.
HGLASER PCB Microelectronics Division provides integrated solutions for
the upstream and downstream industries of PCB such as laser cutting,
marking, automation, and full-process traceability management.
- • Focus on laser applications in SMT
factories, providing customers with automated production line solutions
for laser coding, laser cutting and splitting + testing + automatic
sorting + automatic packaging.
- • Focus on the application of FPC
industry, providing customers with professional solutions for the core
process of FPC cover film roll-to-roll cutting, FPC shape cutting, FPC
high-speed drilling and other industries.
- • Focus on the application of IC
substrate industry in PCB, providing customers with laser marking
equipment for large IC substrates, Xout marking equipment for finished
boards, visual inspection machines for finished boards, AOI inspection
machines, automatic sorting machines, automatic packaging machines and
other full-process laser+ automated solutions.
- • Focus on the advanced packaging industry, providing customers with fully automatic laser marking equipment after IC packaging.
- • Focus on the ceramic substrate
industry, providing customers with fully automatic ceramic substrate
drilling, scribing, cutting and marking equipment.